These engineered composites integrate copper foil layers with specialized dielectric substrates—ranging from polyimide films to liquid crystal polymers and PTFE—to achieve ultra-low dielectric loss, controlled impedance, and exceptional dimensional stability. Copper clad laminate high speed laminate represents a critical material platform enabling high-frequency and high-speed signal transmission in modern electronics. We design, develop, manufacture, and qualify copper-clad laminates and dielectric prepregs used to fabricate multilayer printed circuit boards (PCBs). What is CCL? It is an abbreviation for Copper Clad Laminate. Photoresists for 193 nm and 193 immersion lithography for precision patterning for high-end memory and logic devices.
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